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Get the X-MWblock® drop-in module for this part
Mini-Circuits components are now available as X-MWblock drop-in modules from our partner, X-Microwave to facilitate your evaluation and prototyping.
ECCN# EAR99
Material Declaration
AN0-39 - Speed IM testing
AN0-42 - A guide to surface mount assembly
AN00-008 - Improved two-tone, third order testing
AN03-36 - Measurement methods
AN40-004 - Reflow Soldering of Lead-less LTCC Products
AN40-005 - Prevention and Control of Electrostatic Discharge ESD)
AN40-014 - Surface Mount Assembly of Mini-Circuits Components
D4-D041 - Tape & Reel Packaging For Surface Mount Devices
DG02-23A - Understanding Surface Mount
DG02-32 - Statistical process control
DOUB9-2 - Introduction, definition of terms, Q&As
For detailed questions regarding the performance characteristics and limitations of this product in your intended application, please click Contact Us and we will respond promptly.
PCN18-014 * 02/12/2018 * Material Change
PCN19-092 * 10/15/2019 * Change to layout
PCN25-032 * 05/02/2025 * Transition to alternate qualified ceramic substrate materia
AN40-012 - dBm - volts - watts conversion table
DG03-111 - Return loss vs. VSWR table
SPEC1-2 - Insertion Loss Uncertainty Due to Mismatch Calculator
Hi-Rel
Space Upscreening
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