Found 200 matches (page 14 of 20)
data of Die packaged in industry standard 3x3 mm, 12-lead MCL package IP-3 Output 1dB Comp. Output 17.68 2.36 Note: Test data of Die packaged in industry standard 3x3 mm, 12-lead MCL package FREQ Gain MCL package FREQ Gain Isolation Input Return Loss Output Return Loss Stability IP-3 Output 1dB Comp. in industry standard 3x3 mm, 12-lead MCL package FREQ Gain Isolation Input Return Loss Output Return 2.24 Note: Test data of Die packaged in industry standard 3x3 mm, 12-lead MCL package FREQ Gain
MMIC Amplifier Die TSS-44-D+ Typical Performance Curves Note: Test data of Die packaged in industry standard 3x3 12-lead MCL package 0 5 10 15 20 25 30 20000 22000 24000 26000 28000 30000 32000 34000 36000 38000 40000 42000 44000 G A IN ( d B ) FREQUENCY (MHz) GAIN vs. FREQUENCY & DEVICE VOLTAGE INPUT POWER = -25.00dBm, Temperature = +25°C 3.8V 4.0V 4.2V 30 35 40 45 50 55 60 65 70 75 80 20000 22000 24000 26000 28000 30000 32000 34000 36000 38000 40000 42000 44000 IS O L A T IO N ( d B )
Note: Test data of Die packaged in industry standard 3x3 12-lead MCL package NOTE: Use PDF of Die packaged in industry standard 3x3 12-lead MCL package IP-3 Output 1dB Comp. Output Noise 19.71 8.15 3.97 Note: Test data of Die packaged in industry standard 3x3 12-lead MCL package IP-3 Output
MMIC Amplifier Die TSY-172LNB-D+ Typical Performance Curves Note: Test data of Die packaged in industry standard 2x2 mm, 8-lead MCLP package 0 2 4 6 8 10 12 14 16 18 20 0 200 400 600 800 1000 1200 1400 1600 1800 2000 G A IN ( d B ) FREQUENCY (MHz) GAIN vs. FREQUENCY & DEVICE VOLTAGE INPUT POWER = -25.00dBm, Temperature = +25°C 2.50V 2.70V 2.90V 15 16 17 18 19 20 21 22 23 24 25 0 200 400 600 800 1000 1200 1400 1600 1800 2000 IS O L A T IO N ( d B ) FREQUENCY (MHz) ISOLATION vs. FREQUENCY &
packaged in industry standard 2x2 mm, 8-lead MCLP package NOTE: Use PDF Bookmarks to view DATA at 2x2 mm, 8-lead MCLP package IP-3 Output 1dB Comp. Output Noise Figure FREQ Gain Isolation Input Return industry standard 2x2 mm, 8-lead MCLP package IP-3 Output 1dB Comp. Output Noise Figure FREQ Gain
4 Way-0° Power Splitter/Combiner Die WP4P1-D+ Typical Performance Curves Note: Test data of Die packaged in industry standard, 3x3 mm, 12-lead MCLP package 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 1200 1600 2000 2400 2800 3200 3600 4000 4400 4800 5200 5600 6000 T o ta l L o s s ( d B ) Frequency (MHz) Total Loss Total Loss S-1 Total Loss S-2 Total Loss S-3 Total Loss S-4 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1200 1600 2000 2400 2800 3200 3600 4000 4400 4800 5200 5600 6000 A m p li
Loss + 6dB Splitter Loss Note: Test data of Die packaged in industry standard, 3x3 mm, 12-lead MCLP
4 Way-0° Power Splitter/Combiner Die WP4R-D+ Typical Performance Curves Note: Test data of Die packaged in industry standard, 3x3 mm, 12-lead MCLP package 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 T o ta l L o s s ( d B ) Frequency (MHz) Total Loss Total Loss S-1 Total Loss S-2 Total Loss S-3 Total Loss S-4 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 A m p li tu d e U n b a la n c e ( d B )
12-lead MCLP package TEST CONDITIONS: INPUT POWER = -10dBm @ Temperature = +25°C FREQ. AMP. UNBAL.
MMIC Reflectionless High Pass Filter Die XHF-53H-D+ Typical Performance Curves Note: ”Test data of Die packaged in industry standard 4x4mm, 24-lead MCLP package” 0 10 20 30 40 50 60 70 80 90 10 100 1,000 10,000 100,000 IN S E R T IO N L O S S ( d B ) FREQUENCY (MHz) INSERTION LOSS vs. FREQUENCY INPUT POWER = -10 dBm, Temperature = +25°C 0 5 10 15 20 25 30 10 100 1,000 10,000 100,000 IN P U T R E T U R N L O S S ( d B ) FREQUENCY (MHz) INPUT RETURN LOSS vs. FREQUENCY INPUT POWER = -10 dBm,
